Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152568 | Top-electrode barrier layer for RRAM | Hsing-Lien Lin, Fa-Shen Jiang | 2021-10-19 |
| 11152455 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chia-Shiung Tsai, Chung-Yi Yu, Rei-Lin Chu | 2021-10-19 |
| 11131025 | Wireless camera wafer for vacuum chamber diagnostics | Tzu-Chung Tsai, Hai-Dang Trinh | 2021-09-28 |
| 11094583 | Method of forming a device having a doping layer and device formed | Cheng-Ta Wu | 2021-08-17 |
| 11081563 | Formation of silicide contacts in semiconductor devices | Yan-Ming Tsai, Wei-Jung Lin, Fang Chen | 2021-08-03 |
| 10950490 | Semiconductor device having isolation structures with different thicknesses | Cheng-Ta Wu, Sen-Hong Syue, Cheng-Po Chau | 2021-03-16 |
| 10910560 | RRAM structure | Hai-Dang Trinh, Hsing-Lien Lin, Fa-Shen Jiang | 2021-02-02 |