Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11198606 | Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature | Yi-Ren Wang, Shing-Chyang Pan | 2021-12-14 |
| 11084715 | Segmented pedestal for mounting device on chip | Lee-Chuan Tseng | 2021-08-10 |
| 11078075 | Packaging method and associated packaging structure | Chih-Ming Chen, Chung-Yi Yu | 2021-08-03 |
| 11050012 | Method to protect electrodes from oxidation in a MEMS device | Yi-Ren Wang, Hung-Hua Lin | 2021-06-29 |
| 11040870 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yi-Ren Wang | 2021-06-22 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Ping-Yin Liu | 2021-05-25 |
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2021-04-20 |