Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu, Hung-Hua Lin +1 more | 2021-04-20 |
| 10961118 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Wen-Chuan Tai, Ching-Kai Shen +2 more | 2021-03-30 |
| 10899608 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Wen-Chuan Tai, Ching-Kai Shen +2 more | 2021-01-26 |