Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10961114 | Semiconductor structure and manufacturing method for the same | Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2021-03-30 |
| 10961118 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more | 2021-03-30 |
| 10899608 | Wafer level integrated MEMS device enabled by silicon pillar and smart cap | Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai +2 more | 2021-01-26 |