Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11117796 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2021-09-14 |
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi Heng Tsai +6 more | 2021-08-31 |
| 10961114 | Semiconductor structure and manufacturing method for the same | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2021-03-30 |