Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2021-08-31 |
| 10944041 | Hybrid ultrasonic transducer and method of forming the same | Fu-Chun Huang, Ching-Hui Lin, Chun-Ren Cheng | 2021-03-09 |