Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158739 | Semiconductor structure having field plate and associated fabricating method | Chih-Chang Cheng, Fu-Yu Chu, Ruey-Hsin Liu, Kuang-Hsin Chen, Chih-Hsin Ko | 2021-10-26 |
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Yi-Chuan Teng, Yi Heng Tsai +6 more | 2021-08-31 |
| 11107899 | Plate design to decrease noise in semiconductor devices | Chih-Chang Cheng, Fu-Yu Chu, Ming-Ta Lei, Ruey-Hsin Liu | 2021-08-31 |
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shu-Hui Su, Ting-Chen Hsu +4 more | 2021-07-13 |
| 11011610 | Plate design to decrease noise in semiconductor devices | Chih-Chang Cheng, Fu-Yu Chu, Ming-Ta Lei, Ruey-Hsin Liu | 2021-05-18 |
| 10984211 | Semiconductor device with bioFET and biometric sensors | Ching-Hui Lin, Chun-Ren Cheng, Fu-Chun Huang | 2021-04-20 |
| 10955379 | Differential sensing with BioFET sensors | Ching-Hui Lin, Chun-Ren Cheng, Fu-Chun Huang | 2021-03-23 |