Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu +4 more | 2021-07-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu +4 more | 2021-07-13 |