Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Ting-Chen Hsu +4 more | 2021-07-13 |
SS
Shu-Hui Su
Overall (2021): #260,077 of 548,734Top 50%
1
Patents 2021