Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11104129 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu | 2021-08-31 |
| 11107630 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai +6 more | 2021-08-31 |
| 11097941 | Method of fabricating semiconductor structure | Yi-Hsien Chang, Tzu-Heng Wu, Shih-Wei Lin, Jung-Kuo Tu | 2021-08-24 |
| 11099152 | Backside CMOS compatible BioFET with no plasma induced damage | Yi-Shao Liu, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai, Chun-Wen Cheng | 2021-08-24 |
| 10989685 | Method of using biochip with biosensors | Yi-Shao Liu, Chun-Wen Cheng | 2021-04-27 |
| 10984211 | Semiconductor device with bioFET and biometric sensors | Ching-Hui Lin, Shih-Fen Huang, Fu-Chun Huang | 2021-04-20 |
| 10955379 | Differential sensing with BioFET sensors | Ching-Hui Lin, Shih-Fen Huang, Fu-Chun Huang | 2021-03-23 |
| 10944041 | Hybrid ultrasonic transducer and method of forming the same | Yi Heng Tsai, Fu-Chun Huang, Ching-Hui Lin | 2021-03-09 |