Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11117796 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2021-09-14 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu | 2021-05-25 |