YL

Yi-Chia Lee

VU Versum Materials Us: 9 patents #3 of 64Top 5%
TSMC: 2 patents #1,187 of 3,494Top 35%
Overall (2021): #6,107 of 548,734Top 2%
11
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11186771 Etching solution for selectively removing silicon nitride during manufacture of a semiconductor device Wen Dar Liu 2021-11-30
11180697 Etching solution having silicon oxide corrosion inhibitor and method of using the same Wen Dar Liu, Chung-Yi Chang 2021-11-23
11175587 Stripper solutions and methods of using stripper solutions Jhih Kuei Ge, Wen Dar Liu, Chi-Hsien Kuo 2021-11-16
11091727 Post etch residue cleaning compositions and methods of using the same Laisheng Sun, Lili Wang, Aiping Wu 2021-08-17
11035044 Etching solution for tungsten and GST films Wen Dar Liu, Laisheng Sun, Tianniu Chen, Gang C. Han-Adebekun 2021-06-15
11017995 Composition for TiN hard mask removal and etch residue cleaning Chao-Hsiang Chen, Wen Dar Liu, Chung-Yi Chang 2021-05-25
10961118 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen +2 more 2021-03-30
10954480 Compositions and methods for preventing collapse of high aspect ratio structures during drying Jhih Kuei Ge, Wen Dar Liu, Tianniu Chen 2021-03-23
10934485 Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device Wen Dar Liu, Andrew J. Adamczyk 2021-03-02
10934484 Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ germanium stack during manufacture of a semiconductor device Wen Dar Liu 2021-03-02
10899608 Wafer level integrated MEMS device enabled by silicon pillar and smart cap Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen +2 more 2021-01-26