Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158534 | SOI substrate | Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Yong-En Syu, Yeur-Luen Tu +1 more | 2021-10-26 |
| 11121098 | Trap layer substrate stacking technique to improve performance for RF devices | Kuo-Yu Cheng, Chih-Ping Chao, Kuan-Chi Tsai, Shih-Shiung Chen | 2021-09-14 |
| 11121100 | Trap layer substrate stacking technique to improve performance for RF devices | Kuo-Yu Cheng, Chih-Ping Chao, Kuan-Chi Tsai, Shih-Shiung Chen | 2021-09-14 |
| 11063117 | Semiconductor device structure having carrier-trapping layers with different grain sizes | Yu-Hung Cheng, Yong-En Syu, Kuo-Hwa Tzeng, Ke-Dian Wu, Cheng-Ta Wu +2 more | 2021-07-13 |