CC

Chih-Ping Chao

TSMC: 2 patents #1,187 of 3,494Top 35%
📍 Baoshan, NJ: #1 of 4 inventorsTop 25%
Overall (2021): #174,398 of 548,734Top 35%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11121098 Trap layer substrate stacking technique to improve performance for RF devices Kuo-Yu Cheng, Kuan-Chi Tsai, Shih-Shiung Chen, Wei-Kung Tsai 2021-09-14
11121100 Trap layer substrate stacking technique to improve performance for RF devices Kuo-Yu Cheng, Kuan-Chi Tsai, Shih-Shiung Chen, Wei-Kung Tsai 2021-09-14