Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152414 | Image sensor including dual isolation and method of making the same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Volume Chien | 2021-10-19 |
| 11043522 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2021-06-22 |
| 11018177 | Backside illuminated global shutter image sensor | Shu-Ting Tsai, Tzu-Hsuan Hsu | 2021-05-25 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2021-05-18 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2021-04-27 |
| 10991667 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2021-04-27 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2021-04-13 |