Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043522 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng | 2021-06-22 |
| 11037885 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Pao-Tung Chen +1 more | 2021-06-15 |