Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037885 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Yi-Shin Chu +1 more | 2021-06-15 |
| 10930699 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Jen-Cheng Liu | 2021-02-23 |