Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056573 | Implantation and annealing for semiconductor device | Yu-Chang Lin, Tien-Shun Chang, Chun-Feng Nieh, Sen-Hong Syue, Huicheng Chang | 2021-07-06 |
| 11037781 | Device and method for high pressure anneal | Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang +1 more | 2021-06-15 |
| 11037909 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2021-06-15 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang +1 more | 2021-04-27 |
| 10930699 | Method and apparatus for image sensor packaging | Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu | 2021-02-23 |
| 10910420 | Semiconductor switching device separate by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wei-Cheng Hsu +1 more | 2021-02-02 |