Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195818 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Hsing-Chih Lin | 2021-12-07 |
| 11177307 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2021-11-16 |
| 11114486 | Implant isolated devices and method for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2021-09-07 |
| 11107767 | Structure for standard logic performance improvement having a back-side through-substrate-via | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2021-08-31 |
| 11062977 | Shield structure for backside through substrate vias (TSVs) | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Wei-Tao Tsai | 2021-07-13 |
| 11011568 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Cheng-Hsien Chou | 2021-05-18 |
| 11011567 | Structure and method for 3D image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2021-05-18 |
| 10916502 | Semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2021-02-09 |
| 10910420 | Semiconductor switching device separate by device isolation | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2021-02-02 |