Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195818 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Hsing-Chih Lin, Min-Feng Kao | 2021-12-07 |
PC
Ping-Tzu Chen
Overall (2021): #300,818 of 548,734Top 55%
1
Patents 2021