Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195818 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Min-Feng Kao | 2021-12-07 |
| 11177302 | CMOS image sensor structure with microstructures formed on semiconductor layer | Chien Nan Tu, Yu-Lung Yeh, Chien-Chang Huang, Shih-Shiung Chen | 2021-11-16 |
| 11062977 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Tao Tsai | 2021-07-13 |
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-07-13 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-03-30 |
| 10916502 | Semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2021-02-09 |