Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062977 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2021-07-13 |
WT
Wei-Tao Tsai
Overall (2021): #214,688 of 548,734Top 40%
1
Patents 2021