Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152414 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Volume Chien | 2021-10-19 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2021-06-01 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2021-05-18 |
| 10886320 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu | 2021-01-05 |