Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211419 | Composite bsi structure and method of manufacturing the same | Wei Chuang Wu, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou +3 more | 2021-12-28 |
| 11088192 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Yan-Chih Lu | 2021-08-10 |
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung | 2021-07-20 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2021-06-01 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Shuang-Ji Tsai +3 more | 2021-05-18 |
| 11004880 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2021-05-11 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2021-04-27 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Chih-Hui Huang +3 more | 2021-04-13 |
| 10886320 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2021-01-05 |