Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133237 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-09-28 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-06-15 |