Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075260 | Substrate comprising recessed interconnects and a surface mounted passive component | Kuiwon Kang, Hong Bok We, Jaehyun Yeon | 2021-07-27 |
| 11043740 | Enhanced antenna module with shield layer | Suhyung Hwang, Hong Bok We, Jaehyun Yeon | 2021-06-22 |