Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075260 | Substrate comprising recessed interconnects and a surface mounted passive component | Chin-Kwan Kim, Hong Bok We, Jaehyun Yeon | 2021-07-27 |
| 10971455 | Ground shield plane for ball grid array (BGA) package | Aniket PATIL, Zhijie Wang, Ming Yi | 2021-04-06 |