Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177223 | Electromagnetic interference shielding for packages and modules | Hong Bok We, Brigham NAVAJA | 2021-11-16 |
| 11101220 | Through-package partial via on package edge | Hong Bok We, Jaehyun Yeon | 2021-08-24 |
| 10971455 | Ground shield plane for ball grid array (BGA) package | Kuiwon Kang, Zhijie Wang, Ming Yi | 2021-04-06 |