Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183446 | X.5 layer substrate | Jaehyun Yeon, Suhyung Hwang, Kun Fang | 2021-11-23 |
| 11177223 | Electromagnetic interference shielding for packages and modules | Aniket PATIL, Brigham NAVAJA | 2021-11-16 |
| 11101220 | Through-package partial via on package edge | Aniket PATIL, Jaehyun Yeon | 2021-08-24 |
| 11075260 | Substrate comprising recessed interconnects and a surface mounted passive component | Kuiwon Kang, Chin-Kwan Kim, Jaehyun Yeon | 2021-07-27 |
| 11043740 | Enhanced antenna module with shield layer | Suhyung Hwang, Chin-Kwan Kim, Jaehyun Yeon | 2021-06-22 |