Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183446 | X.5 layer substrate | Suhyung Hwang, Hong Bok We, Kun Fang | 2021-11-23 |
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Chaoqi Zhang, Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon JESSIE, Suhyung Hwang +2 more | 2021-10-05 |
| 11101220 | Through-package partial via on package edge | Hong Bok We, Aniket PATIL | 2021-08-24 |
| 11075260 | Substrate comprising recessed interconnects and a surface mounted passive component | Kuiwon Kang, Chin-Kwan Kim, Hong Bok We | 2021-07-27 |
| 11043740 | Enhanced antenna module with shield layer | Suhyung Hwang, Chin-Kwan Kim, Hong Bok We | 2021-06-22 |