Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11198807 | Thermal interface materials with radiative coupling heat transfer | Anil Yuksel | 2021-12-14 |
| 11195789 | Integrated circuit module with a structurally balanced package using a bottom side interposer | — | 2021-12-07 |
| 11122682 | Tamper-respondent sensors with liquid crystal polymer layers | James A. Busby, John R. Dangler, William L. Brodsky, William Santiago-Fernandez, David C. Long +3 more | 2021-09-14 |
| 11037860 | Multi layer thermal interface material | Eric J. Campbell, Phillip V. Mann, Sarah K. Czaplewski-Campbell | 2021-06-15 |
| 11013147 | Thermal interface material structures | Phillip V. Mann | 2021-05-18 |
| 10993324 | Computer system with modified module socket | Charles L. Arvin, Kevin Drummond, Chris Muzzy | 2021-04-27 |
| 10978313 | Fixture facilitating heat sink fabrication | Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more | 2021-04-13 |