Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11198807 | Thermal interface materials with radiative coupling heat transfer | Mark K. Hoffmeyer | 2021-12-14 |
| 11096277 | Printed circuit board shielding and power distribution via edge plating | Edni Del Rosal, David L. Green | 2021-08-17 |