Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11085708 | Method for improved thermal performance of cold plates and heat sinks | Eric J. Campbell | 2021-08-10 | $4,960,000 |
| 11071235 | Airflow balancing assembly | Sandra J. Shirk/Heath, Mark D. Plucinski, Tyler Jandt | 2021-07-20 | $5,541,000 |
| 11037860 | Multi layer thermal interface material | Mark K. Hoffmeyer, Eric J. Campbell, Sarah K. Czaplewski-Campbell | 2021-06-15 | $4,393,000 |
| 11013147 | Thermal interface material structures | Mark K. Hoffmeyer | 2021-05-18 | $4,116,000 |
| 10982907 | Demand-based charging of a heat pipe | William J. Anderl, Bret P. Elison, Arvind K. Sinha | 2021-04-20 | $5,008,000 |
| 10944191 | Offset ;lug connector on a board connection area | Mark D. Plucinski, Sandra J. Shirk/Heath, Tyler Jandt | 2021-03-09 | $4,710,000 |
| 10923841 | Port for heat sink on active cable end | Karl Stathakis, John R. Harris | 2021-02-16 | $7,591,000 |