Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171102 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2021-11-09 |
| 11094657 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Kamalesh K. Srivastava, Brian R. Sundlof | 2021-08-17 |