Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211378 | Heterogeneous integration structure for artificial intelligence computing | Arvind Kumar | 2021-12-28 |
| 11171006 | Simultaneous plating of varying size features on semiconductor substrate | James J. Kelly | 2021-11-09 |
| 11049844 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Ravi K. Bonam, Dinesh Gupta, James J. Kelly, Kamal K. Sikka, Joshua M. Rubin | 2021-06-29 |
| 10943883 | Planar wafer level fan-out of multi-chip modules having different size chips | Ravi K. Bonam, Dinesh Gupta, James J. Kelly | 2021-03-09 |
| 10923427 | SOI wafers with buried dielectric layers to prevent CU diffusion | Anthony K. Stamper, John A. Fitzsimmons | 2021-02-16 |