Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923427 | SOI wafers with buried dielectric layers to prevent CU diffusion | Anthony K. Stamper, Mukta G. Farooq | 2021-02-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923427 | SOI wafers with buried dielectric layers to prevent CU diffusion | Anthony K. Stamper, Mukta G. Farooq | 2021-02-16 |