Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183455 | Interconnects with enlarged contact area | Koichi Motoyama, Oscar van der Straten, Kenneth Chun Kuen Cheng | 2021-11-23 |
| 11177171 | Encapsulated top via interconnects | Oscar van der Straten, Kenneth Chun Kuen Cheng, Koichi Motoyama | 2021-11-16 |
| 11158538 | Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap | Koichi Motoyama, Oscar van der Straten, Scott A. DeVries, Alexander Reznicek | 2021-10-26 |
| 11069566 | Hybrid sidewall barrier facilitating low resistance interconnection | Oscar van der Straten, Koichi Motoyama, Scott A. DeVries | 2021-07-20 |
| 10950493 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2021-03-16 |
| 10930589 | Advanced interconnects containing an IMT liner | Andrew Tae Kim, Baozhen Li, Chih-Chao Yang | 2021-02-23 |
| 10903116 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Koichi Motoyama, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2021-01-26 |