Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177160 | Double patterned lithography using spacer assisted cuts for patterning steps | Timothy Mathew Philip, Robert R. Robison | 2021-11-16 |
| 11158536 | Patterning line cuts before line patterning using sacrificial fill material | Daniel James Dechene, Timothy Mathew Philip, Robert R. Robison | 2021-10-26 |
| 11139201 | Top via with hybrid metallization | Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2021-10-05 |
| 11062943 | Top via interconnects with wrap around liner | Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2021-07-13 |
| 11024551 | Metal replacement vertical interconnections for buried capacitance | Hsueh-Chung Chen, Lawrence A. Clevenger, Daniel James Dechene, Carl Radens | 2021-06-01 |
| 11004736 | Integrated circuit having a single damascene wiring network | Hsueh-Chung Chen, Junli Wang, Chih-Chao Yang, Lawrence A. Clevenger | 2021-05-11 |
| 10998193 | Spacer-assisted lithographic double patterning | Timothy Mathew Philip, Daniel James Dechene, Robert R. Robison, Lawrence A. Clevenger | 2021-05-04 |