| 11177160 |
Double patterned lithography using spacer assisted cuts for patterning steps |
Timothy Mathew Philip, Robert R. Robison |
2021-11-16 |
| 11158536 |
Patterning line cuts before line patterning using sacrificial fill material |
Daniel James Dechene, Timothy Mathew Philip, Robert R. Robison |
2021-10-26 |
| 11139201 |
Top via with hybrid metallization |
Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger |
2021-10-05 |
| 11062943 |
Top via interconnects with wrap around liner |
Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger |
2021-07-13 |
| 11024551 |
Metal replacement vertical interconnections for buried capacitance |
Hsueh-Chung Chen, Lawrence A. Clevenger, Daniel James Dechene, Carl Radens |
2021-06-01 |
| 11004736 |
Integrated circuit having a single damascene wiring network |
Hsueh-Chung Chen, Junli Wang, Chih-Chao Yang, Lawrence A. Clevenger |
2021-05-11 |
| 10998193 |
Spacer-assisted lithographic double patterning |
Timothy Mathew Philip, Daniel James Dechene, Robert R. Robison, Lawrence A. Clevenger |
2021-05-04 |
