| 11189566 |
Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias |
Dongbing Shao, Lawrence A. Clevenger, Shyng-Tsong Chen, Jing Sha |
2021-11-30 |
| 11177437 |
Alignment through topography on intermediate component for memory device patterning |
Michael Rizzolo, Injo Ok, Theodorus E. Standaert |
2021-11-16 |
| 11022890 |
Photoresist bridging defect removal by reverse tone weak developer |
Zhenxing Bi, Karen E. Petrillo, Nicole Saulnier |
2021-06-01 |
| 11022891 |
Photoresist bridging defect removal by reverse tone weak developer |
Zhenxing Bi, Karen E. Petrillo, Nicole Saulnier |
2021-06-01 |
| 10978550 |
Efficient metal-insulator-metal capacitor |
Kisup Chung, Isabel C. Estrada-Raygoza, Hemanth Jagannathan, Chi-Chun Liu, Yann Mignot |
2021-04-13 |
| 10915085 |
Developer critical dimension control with pulse development |
Richard C. Johnson, Yongan Xu |
2021-02-09 |
