Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189566 | Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias | Dongbing Shao, Lawrence A. Clevenger, Hao Tang, Jing Sha | 2021-11-30 |
| 11038104 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Hiroyuki Miyazoe, Iqbal Rashid Saraf | 2021-06-15 |
| 10915690 | Via design optimization to improve via resistance | Dongbing Shao, Yongan Xu, Zheng Xu | 2021-02-09 |
| 10886168 | Surface modified dielectric refill structure | Chih-Chao Yang, Terry A. Spooner, Koichi Motoyama | 2021-01-05 |