| 11165248 |
Air gap metal tip electrostatic discharge protection |
Qianwen Chen, Yang Liu, Dongbing Shao |
2021-11-02 |
| 11163932 |
Semiconductor process modeling to enable skip via in place and route flow |
Dongbing Shao, Lawrence A. Clevenger |
2021-11-02 |
| 11133670 |
Air gap metal tip electrostatic discharge protection |
Qianwen Chen, Yang Liu, Dongbing Shao |
2021-09-28 |
| 11121318 |
Tunable forming voltage for RRAM device |
Dexin Kong, Kangguo Cheng, Juntao Li |
2021-09-14 |
| 11075200 |
Integrated device with vertical field-effect transistors and hybrid channels |
Zhenxing Bi, Kangguo Cheng, Dexin Kong |
2021-07-27 |
| 11036126 |
Semiconductor fabrication design rule loophole checking for design for manufacturability optimization |
Chieh-Yu Lin, Dongbing Shao, Kehan Tian |
2021-06-15 |
| 11024711 |
Nanosheet FET bottom isolation |
Ruqiang Bao, Zhenxing Bi, Kangguo Cheng |
2021-06-01 |
| 10985236 |
Tunable on-chip nanosheet resistor |
Zhenxing Bi, Kangguo Cheng, Wei Wang |
2021-04-20 |
| 10950545 |
Circuit wiring techniques for stacked transistor structures |
Dongbing Shao, Chen Zhang, Tenko Yamashita |
2021-03-16 |
| 10936782 |
Semiconductor process modeling to enable skip via in place and route flow |
Dongbing Shao, Lawrence A. Clevenger |
2021-03-02 |
| 10930734 |
Nanosheet FET bottom isolation |
Ruqiang Bao, Zhenxing Bi, Kangguo Cheng |
2021-02-23 |
| 10915690 |
Via design optimization to improve via resistance |
Dongbing Shao, Yongan Xu, Shyng-Tsong Chen |
2021-02-09 |
