Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2021-03-02 |