Issued Patents 2021
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152299 | Hybrid selective dielectric deposition for aligned via integration | Nicholas Anthony Lanzillo, Christopher J. Penny, Hosadurga Shobha, Robert R. Robison | 2021-10-19 |
| 11152257 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Christopher J. Penny, Robert R. Robison +1 more | 2021-10-19 |
| 11145543 | Semiconductor via structure with lower electrical resistance | Baozhen Li, Kirk D. Peterson, Terry A. Spooner, Junli Wang | 2021-10-12 |
| 11139201 | Top via with hybrid metallization | Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison | 2021-10-05 |
| 11138890 | Secure access for drone package delivery | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2021-10-05 |
| 11133058 | Analog computing architecture for four terminal memory devices | Timothy Mathew Philip, Kevin W. Brew | 2021-09-28 |
| 11133259 | Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network | Joshua M. Rubin, Arvind Kumar, Steven L. Wright, Wiren D. Becker, Xiao Hu Liu | 2021-09-28 |
| 11132712 | Method for using 3D positional spatial olfaction for virtual marketing | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christoper J. Penny, Michael Rizzolo, Aldis Sipolins | 2021-09-28 |
| 11114410 | Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices | Joshua M. Rubin, Steven L. Wright | 2021-09-07 |
| 11107984 | Protuberant contacts for resistive switching devices | Takashi Ando, Chih-Chao Yang | 2021-08-31 |
| 11101172 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala | 2021-08-24 |
| 11094637 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Joshua M. Rubin, Steven L. Wright | 2021-08-17 |
| 11083837 | Secure medication delivery | Ira L. Allen, Gregory J. Boss, Andrew R. Jones, Kevin C. McConnell, John E. Moore, Jr. | 2021-08-10 |
| 11069564 | Double metal patterning | Hsueh-Chung Chen, Yongan Xu, Yann Mignot, James J. Kelly | 2021-07-20 |
| 11068896 | Granting requests for authorization using data of devices associated with requestors | Spyridon Skordas, Richard C. Johnson | 2021-07-20 |
| 11063089 | Resistive memory device with meshed electrodes | Takashi Ando, Chih-Chao Yang, Michael Rizzolo | 2021-07-13 |
| 11062993 | Contacts having a geometry to reduce resistance | Baozhen Li, Kirk D. Peterson, Terry A. Spooner, Junli Wang | 2021-07-13 |
| 11062943 | Top via interconnects with wrap around liner | Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison | 2021-07-13 |
| 11056429 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2021-07-06 |
| 11049727 | Interleaved structure for molecular manipulation | Shawn P. Fetterolf, Donald F. Canaperi, Kangguo Cheng | 2021-06-29 |
| 11049744 | Optimizing semiconductor binning by feed-forward process adjustment | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis | 2021-06-29 |
| 11043494 | Structure and method for equal substrate to channel height between N and P fin-FETs | Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie, Deepika Priyadarshini +2 more | 2021-06-22 |
| 11024551 | Metal replacement vertical interconnections for buried capacitance | Hsueh-Chung Chen, Daniel James Dechene, Somnath Ghosh, Carl Radens | 2021-06-01 |
| 11018090 | Selective CVD alignment-mark topography assist for non-volatile memory | Michael Rizzolo, Chih-Chao Yang, Benjamin D. Briggs | 2021-05-25 |
| 11018007 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2021-05-25 |