Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multiple patterning scheme integration with planarized cut patterning

Multiple patterning scheme integration with planarized cut patterning

US Patent 11171001 · Granted Nov 9, 2021

Estimated economic value: $5,376,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced capacitance between power via bar and gates2025
Backside self aligned skip via2025
Airgap spacer for power via2025
Selective gas etching for self-aligned pattern transfer2025
Semiconductor passive device integration for silicon-on-insulator substrate2025
Early backside first power delivery network2025
Source/drain contact at tight cell boundary2025
Etch back and film profile shaping of selective dielectric deposition2025
BEOL interconnect subtractive etch super via2025
Interconnect structures with vias having vertical and horizontal sections2025
Wrap around metal via structure2025
Vertical field effect transistor with minimal contact to gate erosion2025