Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088033 | Low resistance source-drain contacts using high temperature silicides | Praneet Adusumilli, Hemanth Jagannathan, Ahmet S. Ozcan | 2021-08-10 |
| 11062956 | Low resistance source-drain contacts using high temperature silicides | Praneet Adusumilli, Hemanth Jagannathan, Ahmet S. Ozcan | 2021-07-13 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo +3 more | 2021-04-13 |
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Stephen M. Rossnagel, Thomas M. Shaw | 2021-03-09 |
| 10943988 | Thermally stable salicide formation for salicide first contacts | Praneet Adusumilli, Emre Alptekin, Ahmet S. Ozcan | 2021-03-09 |
| 10937889 | Forming thermally stable salicide for salicide first contacts | Praneet Adusumilli, Emre Alptekin, Ahmet S. Ozcan | 2021-03-02 |