Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel | 2021-03-09 | $4,710,000 |