Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel | 2021-03-09 |
TS
Thomas M. Shaw
Overall (2021): #233,777 of 548,734Top 45%
1
Patents 2021