Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more | 2021-11-16 |
SK
Seth L. Knupp
Overall (2021): #268,226 of 548,734Top 50%
1
Patents 2021