Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171054 | Selective deposition with SAM for fully aligned via | Son V. Nguyen, Rudy J. Wojtecki, Noel Arellano, Alexander Edward Hess, Cornelius Brown Peethala +1 more | 2021-11-09 |
| 11164776 | Metallic interconnect structure | Son V. Nguyen, Takeshi Nogami, Cornelius Brown Peethala, Matthew T. Shoudy | 2021-11-02 |
| 10937892 | Nano multilayer carbon-rich low-k spacer | Donald F. Canaperi, Richard A. Conti, Eric R. Miller, Son V. Nguyen | 2021-03-02 |