Issued Patents 2021
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195810 | Bonding structure and method of forming same | Hsien-Wei Chen, Jie Chen | 2021-12-07 |
| 11195804 | Semiconductor structure | Ying-Ju Chen, Hsien-Wei Chen | 2021-12-07 |
| 11189599 | System formed through package-in-package formation | Chen-Hua Yu, Sung-Feng Yeh | 2021-11-30 |
| 11183454 | Functional component within interconnect structure of semiconductor device and method of forming same | Hsien-Wei Chen | 2021-11-23 |
| 11164848 | Semiconductor structure and method manufacturing the same | Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu, Chuan-An Cheng | 2021-11-02 |
| 11121084 | Integrated circuit device with through interconnect via and methods of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Jie Chen | 2021-09-14 |
| 11114433 | 3DIC structure and method of fabricating the same | Hsien-Wei Chen | 2021-09-07 |
| 11114413 | Stacking structure, package structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-09-07 |
| 11107779 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Sen-Bor Jan, Chih-Chia Hu | 2021-08-31 |
| 11094613 | Semiconductor structure and manufacturing method thereof | Chih-Chia Hu, Hsien-Wei Chen, Sen-Bor Jan | 2021-08-17 |
| 11088041 | Semiconductor packages with shortened talking path | Hsien-Wei Chen, Jie Chen, Chih-Chia Hu | 2021-08-10 |
| 11088131 | Semiconductor device that uses bonding layer to join semiconductor substrates together | Chen-Hua Yu | 2021-08-10 |
| 11080455 | Layout design of integrated circuit with through-substrate via | Chih-Chia Hu, Sen-Bor Jan, Meng-Wei Chiang | 2021-08-03 |
| 11069658 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Chen-Hua Yu | 2021-07-20 |
| 11069608 | Semiconductor structure and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-20 |
| 11063019 | Package structure, chip structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-13 |
| 11063022 | Package and manufacturing method of reconstructed wafer | Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2021-07-13 |
| 11056438 | Semiconductor packages and method of forming the same | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-06 |
| 11043481 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Wen-Chih Chiou | 2021-06-22 |
| 11043482 | Semiconductor component, package structure and manufacturing method thereof | Hsien-Wei Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2021-06-22 |
| 11031354 | Mixing organic materials into hybrid packages | Hsien-Wei Chen, Chih-Chia Hu, Chen-Hua Yu | 2021-06-08 |
| 11024605 | Integrated circuit package and method | Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2021-06-01 |
| 11018104 | Semiconductor structure and method for manufacturing the same | Hsien-Wei Chen | 2021-05-25 |
| 11018070 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Hsien-Wei Chen | 2021-05-25 |
| 11018066 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2021-05-25 |