Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043481 | Method of manufacturing semiconductor package structure | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou | 2021-06-22 |
| 10950789 | Resisitive random access memory structure and method for forming the same | Bo-Lun Wu, Ting-Ying Shen, Po-Yen Hsu | 2021-03-16 |